Modules
  • MLE1101 Introductory Materials Science and Engineering: Tutorial
  • Introductory aspects of materials science and engineering (i.e. structure, properties and function). Structure on the Atomic scale. Energy levels, atomic orbitals, molecular orbitals; Interatomic bonding, types of bonds (metallic, ionic, covalent, molecular and mixed); Structure of metals, ceramics and polymers. Basic quantum mechanics ideas and introductory band theory; Basic crystallography, imperfection in solids, point and line defects, non-crystalline and semi-crystalline materials, diffusion and diffusion controlled process; Correlation of structure to properties and engineering functions (mechanical, chemical, electrical, magnetic and optical). Discussion of examples for main materials categories (metals, ceramics, polymers).

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  • EE2005 Electronics: Tutorials and Labs
  • This module provides students with a bottom up approach on electronic circuit designs. The module will start with device physics and models for devices such as diode, BJT and MOSFET, followed by simple digital logic gates design and detailed DC/AC analysis of single stage amplifier with different configuration. Equiped with these foundations, students will then explore further on multi-stage amplifier. Frequency analysis technique will also be covered. The module will also illustrate various functional circuit example employing opamp towards the end of this module.

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  • EE5516 Plasma Process and Interconnects: Lecture
  • In the integrated circuits semiconductor process, understanding of plasma technology is very important since many semiconductor processes are carried out in the plasma. Also, understanding of  interconnect technology becomes more important as devices need to operate in the higher frequency regime. This course provides post-graduate students with in-depth knowledge on plasma and material properties required to study semiconductor processing technology.  Most lectures are focused to enhance knowledges of silicon IC device processing which can be very useful for most students aiming to work in the semiconductor area in the future.

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  • EE5520 Micro/NanoElectroMechanical Systems (M/NEMS): Lecture
  • MEMS (Microelectromechanical Systems) technology has been used in many applications such as ink jet printer, projection display, blood pressure sensor and airbag sensor of automotives. With microelectronics technology now pushing deep into the nanometer scale, the time is also right for exploring Nanoelectromechanical Systems (NEMS). Fundamental concepts and technologies in transducer field from micrometer scale to nanometer scale will be analysed. We provide students with knowledge in various applications, such as, optical MEMS/nanophotonics, RF communications, nanosensors and nanoactuators, etc., to catch up with the current challenges facing in the cuttingedge research activities and to be well-equipped for industry employment.

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  • EE5434 CMOS Processes and Integration: Lecture
  • The aim of this module is to provide the crucial understanding of semiconductor processes and integration technologies that are extensively used to fabricate modern electronic devices. This module covers important aspects of CMOS front-end and back-end processes and integration. The students will develop in-depth understanding of integrating the unit process steps to design a device that meets electrical performance specification. The topics covered include Oxidation, Isolation, Gate Module Technology, Diffusion, Ion Implantation, Shallow Junction Technology, Plasma etching process, Thin film deposition, Al/Cu interconnects, Lithography, and CMOS Integration.

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  • EE5433R Functional Devices: Lecture
  • The module is designed to expose the students with a wide range of functional devices and to equip the students with capability of analyzing new emerging devices. Various devices making use of electrical, optical, mechanical, magnetic and thermal properties of different materials will be covered. For each kind of device, a brief history, background knowledge, device structure and characteristics, as well as device applications and outlook will be included.