Dr. Chengkuo Lee

GlobalFoundries Chair Professor in Engineering

Electrical and Computer Engineering

National University of Singapore

Engineering Drive 3

Singapore 117576

elelc@nus.edu.sg

Phone: +65-65165865

Fax: +65-677911034

 

 

Education

  • • Ph.D., in Dept. of Precision Eng., The University of Tokyo, Japan, [1996.02]
  • • M.Sc., in Dept. of Industrial & System Eng., Rutgers, The State University of New Jersey, New Brunswick, NJ, USA [1993.01]
  • • M.Sc., in Dept. of Materials Sci. & Eng., National Tsing Hua Univ., Hsinchu, Taiwan [1991.06]

Employment & Professional Experience

Present Occupation

  • • GlobalFoundries Chair Professor in Engineering, Singapore [2021-Now]

  • • Associate Professor of National University of Singapore, Singapore [2013.01-Now]

Previous Academic Experience

  • • Assistant Professor of National University of Singapore, Singapore [2005.12-2012.12]

    • Joint appointed Senior Member of Technical Staff (SMTS) at Institute of Microelectronics, A*STAR, Singapore [2005.12-2009.06]

    • Adjunct Assistant Professor, Institute of Precision Eng., National Chung Hsing University, Taichung, Taiwan [2001.09-2005.01]

  • • Adjunct Assistant Professor, Dept. of Electrophysics, National Chiao-Tung University, Hsinchu, Taiwan [1997.09-1998.06]
  • • Senior Engineer, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan [1997.01-1997.08]
  • • Japan Science and Technology (JST) Fellow; MEMS & Packaging Group, Adv. Manufacturing Research Institute, AIST, Tsukuba, Japan [1996.01-1996.12]
  • • Associate Foreign Researcher, Nanometer-scale Manufacturing Sci. Lab., Research Center of Advanced Sci. & Tech. (RCAST), The University of Tokyo [1993.04-1996.03]

Previous Industrial Experience

  • • Co-founder & Vice President, Asia Pacific Microsystems, Inc. (APM, Inc), Hsinchu, Taiwan [2001.08-2005.12]
  • • Manager of MEMS Device Dept., Metrodyne Microsystems Co. Ltd., Hsinchu, Taiwan [1997.09-2001.04]

Professional Membership

  • • Member of Materials Research Society (Since 1992)
  • • Member of IEEE (Since 1994)
  • • Member of IEE Japan (Since 1996)

Academic Activity, Achievement & Award
• Publications: International Journal Articles & Letters (133); US Patents (9); Taiwan Patents (26); International Conference Papers & Extended Abstracts (186).
  • •The average ISI citation number per published paper is more than 8.
  • • H-index : 15

• Member of editorial advisory board, Sensors and Materials, from 2019 to now

• Member of editorial advisory board, International Journal of Optomechatronics, from 2009 to now

• Member of editorial advisory board, The Open Electrical and Electronic Eng. Journal, from 2007 to now

POSITION HELD

EVENT

YEAR

Chair/ Co-chair
  • •General chair of the IEEE Intern. Conf. Optical MEMS and Nanophotonics (IEEE OMN 2016), Singapore

Jul. 31 - Aug. 04, 2016
  • •Chair of Steering Committee of the IEEE Intern. Conf. Optical MEMS and Nanophotonics (IEEE OMN 2014), Glasgow, Scotland

Aug. 17 - 21, 2014
  • •Technical Chair of the 6th International Symposium on Microchemistry and Microsystems (ISMM 2014), Grand Copthorne Waterfront Hotel, Singapore.

Jul. 30 - Aug. 1, 2014
• Co-chair of the Symposium on Intelligent sensors in IEEE Ninth Intern. Conf. on Intelligent Sensors, Sensor Networks, and Information Processing (IEEE ISSNIP 2014)
April. 21- 24, 2014
  • •Chair of the IEEE Intern. Conf. Optical MEMS and Nanophotonics (IEEE OMN 2013), Kanezawa, Japan

Aug. 18-22, 2013
  • •Chair of Steering Committee Intern. Conf. on Biosensors, Biomedical Devices, BioMEMS and Applications (Bio4Apps 2013), Tokyo Medical and Dental University, Tokyo, Japan

Oct. 30 and 31, 2013
  • •Local chair of Intern. Conf. on Biosensors, Biomedical Devices, BioMEMS and Applications (Bio4Apps 2012), NUS, Singapore

Nov. 19 and 20, 2012
  • •Co-organizer of Symposium C-4 (Green micro energy management systems) of IUMRS-ICEM, the Intern. Conf. on Electronic Materials 2012 sponsored by Intern. Union of Materials Research Societies (IUMRS), Yokohama, Japan

Sep. 23 - 28, 2012
  • •Chair of Symposium of Optical Passive Devices and Modules of OECC (the 16th Opto-Electronics and Communications Conf.), Kaohsiung, Taiwan.

Jul. 4th – Jul. 8th, 2011
  • •Co-chair of Symposium L (NEMS/MEMS Technology and Devices) of ICMAT (International Conf. of Mat. for Adv. Technol.), Singapore.

Jun. 28th – Jul. 3rd, 2009

Steering Committee/Organizing Committee
  • •Member of Conf. Steering Committee, the 7th Asia-Pacific Conf. on Transducers and Micro/Nano Technologies (APCOT 2014), Exco, Daegu, Korea.

Jun. 29-Jul.2, 2014
  • •Member of Conf. Steering Committee, IEEE Intern. Conf. Optical MEMS and Nanophotonics, Kanezawa, Japan.

Aug. 18-22, 2013
  • •Member of Steering Committee, IEEE 2012 Intern. Conf. Optical MEMS and Nanophotonics, Banff, Alberta, Canada.

Aug. 6th-9th, 2012
  • •Member of Steering Committee, IEEE Intern. Conf. Optical MEMS and Nanophotonics, Istanbul, Turkey.

Aug. 8th-11th, 2011
  • •Member of Technical Programme Steering Committee, IEEE the 17th Intern. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2011), Korea.

Jul. 4 -7, 2011
  • •Member of Steering Committee, IEEE Intern. Conf. Optical MEMS and Nanophotonics (IEEE OMN 2010), Sapporo, Japan.

Aug. 9th-12th, 2010
  • •Member of Organizing Committee, IEEE the 17th Interna. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2010), Singapore.

Jul. 5 -9, 2010

Technical Program Committee

 
  • •Member of Programme Committee of 18th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers 2015), Anchorage, Alaska, USA.

Jun.21-25, 2015
  • •Member of Technical Program Committee of the 28th IEEE Intern. Conf. on Micro Electro Mechanical Systems (MEMS 2015), Estoril, Portugal.

18-22 Jan. 2015
  • •Member of Technical Program Committee of IEEE SENSORS 2014, Valencia, Spain.

Nov. 2-5, 2014
  • •Member of Technical Programme Committee of IEEE SENSORS 2013, Baltimore, Maryland, USA

Nov. 4-6, 2013
  • •Member of Technical Programme  of IEEE the 20th Intern. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2013), Suzhou, China

Jul. 15 -19, 2013,
  • •Member of Technical Program Committee of IEEE SENSORS 2012, Taipei, Taiwan.

Oct. 28-31, 2012
  • •Member of Technical Program Committee of APCOT 2012, the 6th Asia-Pacific Conf. on Transducers and Micro/Nano Technologies, Nanjing, China.

Jul. 8-11, 2012
  • •Member of Technical Program Committee of IEEE International Symposium on Radio Frequency Integration Technology (RFIT 2011), Beijing, China.

Nov. 30-Dec. 2, 2011
  • •Member of Technical Programme Steering Committee, IEEE the 17th Intern. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2011), Korea.

Jul. 4 -7, 2011
  • •Member of Technical Program Committee of IEEE International Symposium on Radio Frequency Integration Technology (RFIT 2009), Singapore.

Dec. 9-11, 2009
  • •Member of Technical Program Committee of IEEE NANOMED 2009, International Conf. on Nano/Molecular Medicine and Engineering, Tainan, Taiwan.

Oct. 18-21, 2009
  • •Program committee member of ISOT 2009 International Symposium on Opto-mechatronic Technologies, Istanbul, Turkey.

Sept. 21-23, 2009
  • •Member of Technical Committee, IEEE the 16th Intern. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2009), Suzhou, China.

Jul. 6 -10, 2009
  • •Member of Technical Committee, IEEE Intern. Conf. on Sustain Energy Technol. (ICSET), Singapore.

Nov. 24-27, 2008
  • •Member of Technical Committee, IEEE the 15th Intern. Symposium on the Physical and Failure Analysis of Integrated Circuits (IEEE IPFA 2008), Singapore.

Jul. 7 -11, 2008

Other activities
•Guest editor of Journal of Nanophotonics, SPIE, in the special issue of Nanophotonic materials and devices.
March 31, 2014
  • •Member of IEEE MTT-S Technical Committee MTT-10 Biological Effect and Medical Applications of RF and Microwave.

Since 2014
  • •Scientific Program Committee Member of the 15th Interna. Conference on Biomedical Engineering (ICBME 2013), Singapore.

Dec. 4-7, 2013
  • •Guest editor of Sensors and Materials (ISSN 0914-4935) in the Special Issue of Biosensors, Biomedical Devices, BioMEMS and Applications (Bio4Apps 2012), Publisher - MYU, Sensors and Materials, 1-23-3-303 Sendagi, Bunkyo-ku, Tokyo 113-0022, Japan.

2012
  • •Committee member of ITRS MEMS Technology Working Group.

since 2011

Academic Leave / Exchange Program

 

•Academic leave at the University of Tokyo (hosted by Prof. ITOH, Toshihiro) under JSPS program to conduct research related to "MEMS Based Solutions: Wireless Sensing Network Modules for Bird Influenza."

June 12-17,  2006

 
  • •Academic leave at Kyushu University (hosted by Prof. SAWADA, Renshi) under JSPS program, 18 June to 23 June 2006 to conduct research related to "Micro-displacement sensor based on SiP (System-in-a-package) technology."

June 18-23,2006