PATENTS
(1). A Method and Apparatus for Cleaning Surfaces, Singapore 114560; |
(2). A Method and Apparatus for Cleaning Surfaces, US 6,777,642 B2; |
(3). A Method and Apparatus for Patterning a Substrate Taiwan, I245812; |
(4). A Method of Patterning a Substrate, Japan 3998974; |
(5). A Method of Patterning a Substrate, Singapore 121697; |
(6). A Method and System of Treating A Surface of A Fabricated Micro-Component, Singapore 121918; |
(7). Dual Laser Beam Singulation of IC Packages Taiwan, I242792; |
(8). Laser-Induced Formation of Spaces on Flat Panel Display Substrates Singapore, 200103998-1; |
(9). Matrix Laser Cleaning Germany, WO2006/050950A1; |
(10).Method and Apparatus for Cleaning Inkjet Cartridges Singapore, 96643; |
(11).Method and Apparatus for Cleaning Inkjet Cartridges, US 6,828,524 B2; |
(12).Method and Apparatus for cutting a Multi-layer Substrate by Dual Laser Irradiation, Japan3512400; |
(13).Method and Apparatus for cutting a Multi-layer Substrate by Dual Laser Irradiation, Singapore 108262; |
(14).Method and Apparatus for cutting a Substrate using Laser Irradiation, US 6,753,500 B2; |
(15).Method and Apparatus for Decapping Integrated Circuit Packages, US6,917,011 B2; (Licensed) |
(16).Method and Apparatus for Decapping Integrated Circuit Packages, Singapore 200104149-0; (Licensed) |
(17).Method and Apparatus for Decapping Integrated Circuit Packages Taiwan, I253151; (Licensed) |
(18).Method and Apparatus for Deflashing of Integrated Circuit Packages, US6,838,637B2; |
(19).Method and Apparatus for Deflashing of Integrated Circuit Packages, Singapore 96648; |
(20).Method of Laser Marking and Apparatus Therefor, US 6,822,189 B2; |
(21).Method of Laser Marking and Apparatus Therefor, UK GB2380978; |
(22).Method of Laser Marking and Apparatus Therefor, Japan 3779639; |
(23).Method of Laser Marking and Apparatus Therefor, Singapore 200106342-9; |
(24).Method of Patterning a Substrate, US 6,835,319 B2. |