Chengkuo Lee

Assistant Professor

PhD The Univ. of Tokyo, Japan; 1996
MSc Rutgers Univ., New Brunswick, NJ, USA; 1993
MSc National Tsinghua Univ., Taiwan; 1991

Joint-appointed SMTS (Senior 
member of technical staff) 
of IME (Institute of 
Microelectronics), A*STAR, 

Phone:(65) 6516 5865Fax:(65)67791103Email:eleLC


Professional Working Experience

Full time occupation:
1.Co-founder & Vice President, Asia Pacific Microsystems, Inc. (APM, 
Inc.), Hsinchu, Taiwan [2001.09]
2.MEMS Devise Department Manager, Metrodyne Microsystems Co. Ltd., 
Hsinchu, Taiwan [1997.09]
3.Senior Engineer, Industrial Technology Research Institute (ITRI), 
Hsinchu, Taiwan [1997.01]
4.JST Fellow; MEMS & Packaging Group, Adv. Manufacturing Research 
Institute, AIST, Tsukuba, Japan [1996.01]		

Adjunct occupation:
1.Adjunct Assistant Professor, Institute of Precision Eng., National 
Chung Hsing University, Taichung, Taiwan [2001.09-2005.01]
2.Adjunct Assistant Professor, Dept. of Electrophysics, National 
Chiao-Tung University, Hsinchu, Taiwan [1997.09-1998.06]
3.Associate Foreign Researcher, Nanometer-scale Manufacturing Sci. 
Lab., Research Center of Advanced Sci. & Tech. (RCAST), The 
University of Tokyo [1993.04-1996.03]

Professional Activities

Professional Affiliation:
Member of Materials Research Society (Since 1992)
Member of IEEE (Since 1994)
Member of IEE Japan (Since 1996)

International/National Seminars and Public Talks:		
1.Optical Micro-NanoSystems:Technology Overview & Business¬°@
Opportunity, Public talk at 2nd Seminar of The Frontier of Nano Tech 
& Business, hosted by Fukuoka Nano Technology Promotion Conference 
and Fukuoka Industry, Science & Technology Foundation, Fukuoka, 
Japan. (21 June, 2006)

Academic Leave / Exchange Program:
1.Academic leave at the University of Tokyo (hosted by 
Prof. ITOH, Toshihiro) under JSPS program, 12 June to 17 June 2006 
to conduct research related to "MEMS Based Solutions: Wireless 
Sensing Network Modules for Bird Influenza."
2.Academic leave at Kyushu University (hosted by 
Prof. SAWADA, Renshi) under JSPS program, 18 June to 23 June 2006 to 
conduct research related to "Micro-displacement sensor based on SiP 
(System-in-a-package) technology."