Chengkuo Lee received a M.S. degree in Materials Science and Engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1991. He also received a M.S. degree in Industrial and System Engineering from Rutgers University, New Brunswick, NJ, USA in 1993. He received the Ph.D. degree in Precision Engineering from the University of Tokyo, Tokyo, Japan, in Jan. 1996. He worked as foreign researcher in the Nanometer-scale Manufacturing Science Lab. at Research Center for Advanced Science and Technology (RCAST) of the University of Tokyo from 1993 to 1996. He had also worked in Mechanical Engineering Lab., AIST, MITI of Japan as a JST research fellow in 1996. Thereafter he was a senior research staff of Microsystems Lab., Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan. Since Sept. 1997, he has joined the Metrodyne Microsystem Corporation, Hsinchu, Taiwan, and established the MEMS device division and the 1st micromachining Fab. for commercial purpose in Taiwan. He was the manager of MEMS device division between 1997 and 2000. He had been the adjunct assistant professor in Electro-physics Department of National Chiao Tung University in 1998, and the adjunct assistant professor in Institute of Precision Eng. of National Chung Hsing University since 2001 to 2005. He co-founded the Asia Pacific Microsystems, Inc. (APM) Hsinchu, Taiwan, in Aug. 2001, and he has been the vice president (VP) of R&D at the beginning, then become the VP of optical communication business unit and special assistant of CEO in charge of international business and technical marketing for MEMS foundry service at APM, Inc. till end of 2005. APM has achieved annual revenue of 13M US$ in 2005 and was ranked as top number 30 of world MEMS manufacturers in 2004. From 2006 to 2009, he has been a senior member of technical staff at the Institute of Microelectronics (IME), A*STAR, Singapore. Currently, he is an Associate Professor at the Dept. of Electrical and Computer Eng. of National University of Singapore, Singapore. He is the steering committee member of IEEE International Conf. on Optical MEMS and Nanophotonics. He is the member of editorial advisory board ofInternational Journal of Optomechatronics by Taylor & Francis. He is the co-author of a book in title ofAdvanced MEMS Packaging, McGraw-Hill, 2010. He has contributed more than 250 papers in peer-reviewed international journals and conferences, and 9 US patents in MEMS, NEMS, Nanophotonics and Nanotechnology fields. He is the member of IEEE, MRS, and IEE Japan.