Patents Granted

 
(1). A Method and Apparatus for Cleaning Surfaces, Singapore 114560;

(2). A Method and Apparatus for Cleaning Surfaces, US 6,777,642 B2;

(3). A Method and Apparatus for Patterning a Substrate Taiwan, I245812;

(4). A Method of Patterning a Substrate, Japan 3998974;

(5). A Method of Patterning a Substrate, Singapore 121697;

(6). A Method and System of Treating A Surface of A Fabricated Micro-Component, 
     Singapore 121918;

(7). Dual Laser Beam Singulation of IC Packages Taiwan, I242792;

(8). Laser-Induced Formation of Spaces on Flat Panel Display Substrates Singapore, 
     200103998-1;

(9). Matrix Laser Cleaning Germany, WO2006/050950A1;

(10).Method and Apparatus for Cleaning Inkjet Cartridges Singapore, 96643;

(11).Method and Apparatus for Cleaning Inkjet Cartridges, US 6,828,524 B2;

(12).Method and Apparatus for cutting a Multi-layer Substrate by Dual Laser Irradiation, 
     Japan3512400;

(13).Method and Apparatus for cutting a Multi-layer Substrate by Dual Laser Irradiation, 
     Singapore 108262;

(14).Method and Apparatus for cutting a Substrate using Laser Irradiation, US 6,753,500 B2;

(15).Method and Apparatus for Decapping Integrated Circuit Packages, US6,917,011 B2; 
     (Licensed)

(16).Method and Apparatus for Decapping Integrated Circuit Packages, Singapore 
     200104149-0; (Licensed)

(17).Method and Apparatus for Decapping Integrated Circuit Packages Taiwan, I253151; 
     (Licensed)

(18).Method and Apparatus for Deflashing of Integrated Circuit Packages, US6,838,637B2;

(19).Method and Apparatus for Deflashing of Integrated Circuit Packages, Singapore 
     96648;          

(20).Method of Laser Marking and Apparatus Therefor, US 6,822,189 B2;

(21).Method of Laser Marking and Apparatus Therefor, UK GB2380978;

(22).Method of Laser Marking and Apparatus Therefor, Japan 3779639;

(23).Method of Laser Marking and Apparatus Therefor, Singapore 200106342-9;

(24).Method of Patterning a Substrate, US 6,835,319 B2.