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SNDL >
Facilities |
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Cleanroom |
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Industry standard cleanroom facility (class 1~100, 6 & 8 inch wafer
processing) |
► Total
Area : 517 m2
– Cleanroom Area : 420 m2 (SNDL : 299 m2,
ISML : 90 m2, yellow room: 31 m2)
– Service Area : 97 m2 |
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Utility
Room & Chiller Yard |
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SNDL
is empowered with
multi-million
dollar's state-of-the-art equipment |
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Gate module cluster tool:
Jusung MOCVD
system |
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Etching module:
LAM Etcher
Cluster
&
ICP |
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Ultra-fast rapid thermal
processors: RTP-1 (front-end) & RTP-2 (general) |
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Advanced high-k deposition chamber: Genus ALD
System |
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Full set of
FurnaceTubes,
Asher,
Sputter,
Wet
Station |
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E-beam evaporator, UHV Epi
tool, nano-wire tool |
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Lithography tools:
Mask
Aligner, E-beam lithography system |
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Inspection tools: Ellipsometer, 4-point probe, surface profiler, probe stations,
XPS |
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