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Industry Talk > Micron Industry cum Recruitment Talk

Micron Industry cum Recruitment Talk


Date : 13 August 2007 (Monday)

Time : 12 noon to 1 pm

Venue : LT7

Seminar : Micron Industry cum Recruitment Talk

Speaker : Giam Siang Tian, Micron
Product Engineering Manager

Abstract

The life of a DRAM.
How engineers help transform the humble silicon.
Semiconductor Manufacturing in Singapore.
What to look for in your career?
Programs for students –
Industrial Attachments, Internships, Scholarships.

Biography

Mr Giam received his first degree from the Electrical and Electronics Department at National University of Singapore (NUS) in 1990. Subsequently, he took up a full-time Research Scholarship in NUS and graduated in 1991 with Master of Engineering(EE). 

In 1991, Mr Giam joined Texas Instruments as a product engineer. He has supported the startup, qualification and ramp of TI 4Meg Dram devices. He was promoted to Product Engineering Section Manager in 1994 and is responsible for all TI 16Meg Dram product, including the conversion of 0.5um Trench-cell technology to 0.4um Stack-Cell technology. Mr Giam was subsequently promoted to Product Engineering Manager in 1998 and is responsible for new product development in Micron Semiconductor Asia. The product portfolio ranges from the different type of memory products including DDR/DDR2 Sdram and Mobile Sdram.

Mr Giam has made significant contribution in the development of new test concepts/methodology for testing the Dram device. This includes built-in design features in the Dram chip to allow more efficient way of testing and stressing the Dram product. In the field of electrical failure analysis and design. Mr Giam has worked extensively on different type of failure mechanism throughout his career in Micron and Texas Instruments. His knowledge of test extends all the way from probe to backend test, and deal with ways to optimize the tests at the respective site.

In area of new product startup, Mr Giam supervises a team of product engineers & managers who are responsible for addressing any process, defects and design problems associated with the memory product. The team is also responsible for the design verification/simulation of the new product, and making design changes as needed to fix any design marginalities.

 
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Last modified on 8 August 2007 by Department of Electrical & Computer Engineering